Samsung Electronics Chairman Lee Jae-yong visited the company’s Advanced Package Lab (APL) in Yokohama, Japan, on Sunday, November 1. The lab focus to help Samsung develop better ways to package chips that power artificial intelligence (AI) systems. Samsung wants the center to become a global research hub for this technology.
Lee met with researchers to review their work on new materials and methods for advanced chip packaging. He also discussed closer cooperation with Japanese companies that produce chip materials, parts and equipment. Samsung said Lee highlighted the importance of advanced packaging in helping the company stay competitive as demand for AI chips continues to grow.
Samsung officially opened the Yokohama lab on September 8, after setting it up in 2023. The company spent the next two years preparing the site and starting early research. Samsung plans to invest 350 billion won, which is about $262 million, in the lab over five years through 2028. The company also aims to bring in more local researchers and develop the facility into a leading center for advanced chip packaging research. The lab will work closely with Samsung’s packaging team in South Korea.
Chipmakers call this process advanced semiconductor packaging. It brings different parts of a chip system together in a single package so they can work together. It can place a processor and memory close to each other, helping them share data faster while using less power. These features matter for AI systems, which need to process large amounts of data.
AI systems use graphics processing units(GPUs) to perform complex tasks. They also need high-bandwidth memory, which people call HBM. It moves data quickly between memory and the processor. Advanced packaging connects these parts in a small space. Close connections can improve speed and reduce power use.
Samsung’s Yokohama team will study new methods such as wafer bonding and the use of glass materials in chip packages. Wafer bonding joins thin layers of chip material with great care. Glass materials may support new package designs. Samsung says the lab will also develop designs that aim to deliver high performance while using less power.
Japan gives Samsung access to many companies with deep skills in chip materials, parts and equipment. These suppliers make materials, parts and tools for chip production and packaging. Yokohama is also located near Tokyo and has universities and research centers that can help Samsung find skilled workers and research partners. Samsung wants the lab to link its chip design and production skills with Japan’s supply network. Samsung also plans to work with local universities and researchers.
This visit is part of Samsung’s long-term plan to expand its AI chip business. In July, Samsung announced a technology partnership with U.S.-based chipmaker Broadcom. This partnership covers memory, chip production and advanced packaging for future AI systems. The two companies also plan to work on high-bandwidth memory and other technologies used in AI processors.
The growing focus on advanced packaging shows that chip performance depends on more than just the processor. Memory, materials and the way different parts are connected also play an important role in speed, power use and heat control. Through its Yokohama lab, Samsung aims to improve these technologies and build closer ties with Japanese tech companies and suppliers. The effort comes as demand for more powerful AI chips continues to rise across industries.
